Hareup jeung Rear Lampu Mobil
syarat teknis | ||||||
Jenis produk | Single-sided Flex PCB | |||||
Jumlah lapisan | 1 Lapisan | |||||
Lebar garis jeung spasi garis | 1.8MM / 0.5MM | |||||
Ketebalan piring | FPC = 0.15MM T = 1.15MM | |||||
Kandel pilem | 50UM | |||||
konduktivitas termal | 3.00 | |||||
Perlakuan permukaan | ENG 2-3U | |||||
Ketebalan tambaga | 1 OZ | |||||
Kakaku | lambaran aluminium 1.0mm | |||||
Ciri | Lambaran aluminium digambar sareng digabungkeun sareng napel termal. | |||||
Kandaraan Aplikasi | BYD | |||||
Aplikasi | Hareup jeung Rear Lampu Mobil |
![Hareup-jeung-Pungkur-Mobil-Lampu](http://www.capelfpc.com/uploads/Front-and-Rear-Car-Lights1.jpg)
![Hareup jeung Rear Lampu Mobil02](http://www.capelfpc.com/uploads/Front-and-Rear-Car-Lights02.jpg)
Pameran aplikasi
waktos pos: Aug-10-2023
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